Labels Milestones
BackPitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x06 2.54mm single row style2 pin1 right Through hole IDC header, 2x30, 2.00mm pitch, single row Surface mounted socket strip THT 2x31 2.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x10, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x26 2.00mm single row Surface mounted pin header SMD 1x21 2.00mm.
New Pull Request