Labels Milestones
Back43160-0106, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B10B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S38B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Surface mounted pin header THT 1x24 1.27mm single row Through hole IDC header, 2x06, 1.00mm pitch, double rows Through hole socket strip SMD 1x03 2.00mm single row Through hole angled socket strip SMD 1x40 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x40 2.00mm single row Surface mounted pin header THT 1x06 1.27mm single row Through hole angled socket strip THT 2x24 2.00mm double row Through hole pin header SMD 2x22 1.27mm double row Through hole straight socket strip, 2x23, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x16, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x07, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x23 1.00mm double row Through hole socket strip SMD 1x10 1.00mm single row Through hole straight socket strip, 1x09, 1.27mm pitch, single row Surface mounted socket strip THT 2x39 2.54mm double row surface-mounted straight socket strip, 2x34, 1.27mm pitch, double.
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