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113.5375 (end 168.6 113.6875 (end 161.6 75.25 (end 162.35 77.1525 (end 155.1 149.37 (end 155.706823 109.135 (end 150.75 145.02 (end 156.755141 108.086682 (end 155.615 109.135 (end 150.75 145.02 (end 156.755141 101.025141 (end 150.75 145.02 (end 156.755141 101.025141 (end 150.75 145.02 (end 156.755141 101.025141 (end 150.75 114 (end 174.5025 116.939474 (end 172.941974 118.5 (end 171.39 117.999999 (end 162.25 131.75 (end 162.9025 129.1975 (end 171.39 121.975 (end 171.953606 129.605 (end 177.75 128.75 (end 166.4475 128.75 (end 165.75 122.535 (end 166.31 121.975 (end 168.85 106.357184 (end 178.35 116.75 (end 168.85 121.975 (end 179.25 125 (end 164.22 117.97 (hatch edge 0.5 "name": "Grouped By Value", (offset 0.762) hide (end -3.81 -2.54 (end -2.54 -5.08 (offset 1.016) hide (end 0 -0.127 (end 0 2.413 (end 0 -10.287 (end 0 4.435 (end 0 10.033 (end 1.27 -13.97 (end 2.286 1.016 (end -2.286 -1.016 (offset 0.254) hide (end 1.016 2.54 (end -1.016 -2.54 (offset 0) hide From 5a4d5850276107dae545a96ba13aec19af1bdbba Mon Sep 17 00:00:00 2001 Subject: [PATCH] Use THT electrolytics, finish SMT layout, try on quentin font Schematics/Enlarge/Enlarge.kicad_prl | 77 Schematics/Enlarge/Enlarge.kicad_pro | 143 C1 is too small for a single 0.15 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF63 through hole, DF11-24DP-2DSA, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV-BE-A, 42 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105309-xx04, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5268-13A, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SH series connector, S10B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a 1uF capacitor. 1uF may be unnecessary, though. - C10, C14 too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be more robust.

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