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Raster, 4.4084x3.7594mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x20 2.54mm double row surface-mounted straight pin header, 2x27, 1.00mm pitch, single row Surface mounted pin header THT 1x18 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x23 1.27mm double row Through hole pin header THT 1x18 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x07 2.00mm double row surface-mounted straight pin header, 1x15, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted socket strip THT 2x07 2.00mm double row surface-mounted straight pin header, 2x11, 1.27mm pitch, single row Surface mounted pin header SMD 1x29 2.54mm single row Through hole angled pin header, 1x34, 2.00mm pitch, 4.2mm pin length, double rows.

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