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14-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S2 MOSFET Infineon PLCC, 20 pins, through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, SPST, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Finder 32.21-x300 Relay SPST Schrack-RT1 RM3.5mm 8A 250V AC Relay Relay DPDT.

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