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3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL ZIF 15.24mm 600mil Socket.

0.0827209 0.993289 vertex 5.83299 -4.3279.
File Hardware/Panel/precadsr_panel.svg Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_SilkS.gbr.
0.876745 -0.468624 0.108209 vertex -2.5504 -5.20733 21.335.

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