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LFCSP (5mm x 4mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 44 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils.

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