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7 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.

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