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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 464, 2.58x3.07mm, 36 Ball.

• Vertex -4.7566 -7.11876 5.56266 facet normal.
• SRR1005 SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRR1260.pdf SMD Inductor Bourns SRR1260.
• 155.96 120 (end 154.25 129.25 (end 158.5.
• "License"); Copyright (c) 2010 "Cowboy" Ben Alman Permission.

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