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IMAGE.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/BLADE BARRIER.png and /dev/null differ Latest commits for file Synth_Manuals/VALMORIFICATION+Build+and+BOM.pdf MK_VCO/Fireball/Fireball VCO saw wave core.circuitjs.txt MSD: mid surdo (sometimes MS1, MS2, etc, if pattern spans measures or has planned variations) BSD: back surdo (L for low, H for high) R/L: accented note (right/left hand suggested r/l Quieter, unaccented note * A trill, generally three very fast notes on updating the fireball for rev 2 beta d89db83df13552281151487e636d3175f5aa0e7b updates to rev 2 's notes on repique/caixa, two or three for surdos paper "A4") Add Kick as separate sheet 2bb058d571 initial kicad project .../OttosIrresistableDance.kicad_pcb | 2 pin Molex connector 2.54 mm spacing | | R4, R6, R7, R30, R31 Switch, dual pole double throw, center OFF position K switch normally-open pushbutton push-button D Push button switch, generic, two pins K switch normally-open pushbutton push-button Lamp D Push button switch, generic, two pins Switch, single pole double throw D Switch, single pole normally-open illuminated tactile switch SPST right angle, PTS645VL31-2 LFS tactile switch 6mm ALPS SKHH right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf hdmi micro type d right angle (http://www.molex.com/pdm_docs/sd/483930003_sd.pdf USB 3.0 type A Plug, Horizontal, http://cnctech.us/pdfs/1001-011-01101.pdf USB-A receptacle horizontal through-hole USB_B USB B receptacle horizontal through-hole GCT USB1046, USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, * Knurl polyhedron depth, * Cylinder ends smoothed height, * Knurled cylinder outer diameter, generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-20S-0.5SH, 20 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin thermal pad TSSOP HTSSOP 0.65.

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