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Back# Format documentation: https://kicad.org/help/file-formats/ # Temporary files *.000 *.bak *.bck *.kicad_pcb-bak *.kicad_sch-bak *-backups *.kicad_prl *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Netlist files (exported from Eeschema) *.net # Autorouter files (exported from Pcbnew) *.dsn *.ses New KiCad version; non Al panel Gerbers # Netlist files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View File Datasheets/2N3903-Motorola.pdf Executable file View File sr1_full.png Normal file View File 3D Printing/Cases/Eurorack.
- "Layer F.Mask" "Notes": "Layer B.Cu" "Notes": "Layer.
- TO-262, https://www.boydcorp.com/aavid-datasheets/Board-Level-Cooling-Plug-In-5768.pdf Heatsink, 25.4x25.4x42.54mm, TO-220, https://www.boydcorp.com/aavid-datasheets/Board-Level-Cooling-Channel-5903.pdf.
- Nichicon, 6.3x7.7mm SMD capacitor, aluminum.
- Pitch=5.08mm, 0.25W = 1/4W length 6.3mm.
- -0.801128 -0.594344 0.0703587 facet normal -3.018798e-15 -5.520443e-15 1.000000e+00.