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Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad 3x2mm Pitch 0.5mm vertical Molex SPOX Connector System, 53047-1410, 14 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100.

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