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2x3x0.6 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, surface mount SMD package TO-269AA (e.g. Diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf Diotec MicroDil diode bridge package, diameter 8.9mm, pin pitch 10.00mm length 11.0mm solder Pin_ with flat fork, hole diameter 1.2mm, length 11.3mm, width 3.0mm solder Pin_ press fit solder Pin_ with flat fork, hole diameter 1.0mm, wire diameter 0.8mm Test point with 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED10-4500RT%23KIN.pdf LED diameter 3.0mm 2 pins LED, Round, FlatTop, diameter 5.0mm, 2 pins.

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