3
1
Back

Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin (https://b2b-api.panasonic.eu/file_stream/pids/fileversion/2787), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/5-G-5.08; number of pins: 12; pin pitch: 5.00mm; Angled; threaded flange || order number: 1923869 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/2-GF-3.81; number of pins: 10; pin pitch: 3.81mm; Angled; threaded flange || order number: 1923869 16A (HC Generic Phoenix Contact connector footprint for: GMSTB_2,5/3-GF-7,62; number of pins: 04; pin pitch: 5.08mm; Vertical || order number: 1776922 12A || order number: 1847482 8A 320V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/4-G; number of pins: 12; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1924091 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/10-G-7,62; number of pins: 10; pin pitch: 3.50mm; Angled || order number: 1776002 12A Generic Phoenix Contact connector footprint for: MSTBV_2,5/2-GF-5,08; number of pins: 05; pin pitch: 3.50mm; Vertical .

New Pull Request