3
1
Back

(ML) - 8x8x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 9.6.

New Pull Request