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Metal nose with efficient chassis ground connection, T+R+S normalling contact, https://www.neutrik.com/en/product/nrj6hm-1-au Slim Jacks, 6.35mm (1/4in) mono jack, switched, fully threaded nose, https://www.neutrik.com/en/product/nrj6hf Slim Jacks, 6.35mm (1/4in) stereo jack, vertical PCB mount, color coding possible, https://www.neutrik.com/en/product/nc5fav-sw A Series, 3 pole XLR female receptacle with 6.35mm (1/4in) stereo jack, vertical PCB mount, https://www.neutrik.com/en/product/nc4fah A Series, 4 pole female XLR receptacle, grounding: without ground/shell contact, vertical PCB mount, https://www.neutrik.com/en/product/nc4mbv A Series, Chassis connector Phoenix H male (A series layout), horizontal PCB mount, https://www.neutrik.com/en/product/nc3faav A Series, Chassis connector H female (A series layout), horizontal PCB mount, https://www.neutrik.com/en/product/nc3maav-1 AA Series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, vertical PCB mount, https://www.neutrik.com/en/product/nc3faav1 AA Series, 3 pole male XLR receptacle, grounding: without ground/shell contact, vertical PCB mount, https://www.neutrik.com/en/product/nc3mav B Series, 3 pole XLR female receptacle with 6.35mm (1/4in) stereo jack, horizontal PCB mount, https://www.neutrik.com/en/product/nc4mav B Series, 3 pole male XLR receptacle, grounding: separate ground contact connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat Pack, 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBJ0008 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-10A.

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