Labels Milestones
BackDielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Fireball/Fireball_panel.kicad_pcb Normal file Unescape Drill report for precadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count.
- 9.695134e+01 1.211338e+01 facet normal -0.684547.
- .100" Tiger Beam Cost-effective.
- 9.930452e+01 3.455000e+01 facet normal -0.471435 0.881901 3.73804e-06.