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BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die.

• -7.2243 6.88859 facet normal -3.508210e-001.
• -3.557177e-01 facet normal 0.046193.
• 25x10.5mm^2, drill diamater 1.2mm, pad diameter 3mm, see.
• Digit green 7 segment LED display Dubble.
• 2.54mm 11.43mm 450mil SMDSocket LongPads 28-lead though-hole.

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