Labels Milestones
BackBanana panel socket, through-hole, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET.
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