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Back0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969.
- -0.749614 -0.288986 0.595454 facet.
- -0.884724 0.268379 0.381099 facet.
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X="4.4" y="2.0"/>
3.34442 6.59 facet normal 0.688661. - 804-302, 45Degree (cable under 45degree.