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Hole 3.3mm, height 7, Wuerth electronics 9776020960 (https://katalog.we-online.com/em/datasheet/9776020960.pdf), generated with kicad-footprint-generator JST VH series connector, 502585-0570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator connector Molex Pico-Lock series connector, 202396-0207 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 76 Pin (https://www.marvell.com/documents/bqcwxsoiqfjkcjdjhkvc/#page=19), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5268-14A, 14 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0007 example for new part number: A-41792-0005 example for new mpn: 39-29-4249, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2151, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-D (7343-31 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S12B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PHD series connector, S20B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm SSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator JST SHL top entry Molex Micro-Fit 3.0 Connector System, 43045-1400 (alternative finishes: 43045-142x), 7 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63-5P-3.96DSA, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Micro Leadframe Package, 16 pin with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad TSSOP, 14 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2041, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator JST GH series connector, SM02B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH41-30S-0.5SH, 30 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4110, 11 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 7 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST EH series connector, S8B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD.

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