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BackPitch, 1.854mm thermal pad with vias HTSSOP, 20 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 4 pin, Right Angle, Surface Mount Fuse with Clip, 4.2 x 11.1 mm, Time-Lag T, 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMZ_250.pdf fuse smd mount holder SunFuse Ceramic Slow Blow Fuse 6H_6HP.PDF UL/CSA 6x32mm Ceramic Slow Blow Fuse Fuseholder.
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