Labels Milestones
BackPQFP, 112 pins, 20mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62.
- Connector, 505405-1570 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with.
- 0.0979087 0.995195 0 facet.
- 1140A5L 114001E 1140A2U 114001T.