Labels Milestones
BackAI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1760 1.
- All The MIT License Copyright (c) 2019.
- (https://www.molex.com/pdm_docs/sd/2005280270_sd.pdf), generated with kicad-footprint-generator.
- 0.996728 -0.0397839 -0.0703599 vertex.
- Vertex -4.165181e+000 -5.186868e-002 2.494118e+001 vertex -1.726257e+000 4.991016e+000 2.494118e+001.