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RLRLR-- <- it's a 5-roll, and a momentary-on button to advance the step LED + 23mm hole_left = slider_center - 13; hole_bottom = hole_top - 89.75; hole_right = hole_left + 78.5; footprint "eurorack_rail_hole" (version 20221018) (generator pcbnew min_thickness 0.254) (filled_areas_thickness no Binary files /dev/null and b/3D Printing/Pot_Knobs/potentiometre_v3_1.5_merged.stl differ Binary files a/Panels/title_test.stl and b/Panels/title_test.stl differ Binary files /dev/null and b/HIHAT_MANUAL.pdf differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/COLOR SPRAY.png differ Binary files a/Panels/futura medium bt.ttf | Bin 0 -> 16561 bytes 3D Printing/Panels/MAGIC MISSILE VCF.png | Bin 0 -> 12724 bytes .../POLYMORPH.png | Bin 16561 -> 0 bytes Latest commits for file PSU/psu.diy Add PSU PSU/PSU.md | 5 create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Jack_Hole_NPTH.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alps_RK163_Single_Horizontal.kicad_mod create mode 100644 3D Printing/Rails/18hp_outie.stl | Bin 0 -> 170624 bytes README.md | 5 | 22k | Resistor | | | | C1, C11 | 3 | 1 | SW_SPDT | SPDT miniature toggle switch could be done at the module ' help(); ' for a single 2 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3, Wuerth electronics 9774050943 (https://katalog.we-online.de/em/datasheet/9774050943.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, LY20-22P-DT1, 11 Circuits (https://www.molex.com/pdm_docs/sd/2005280110_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-3210, 32 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-E (7360-38 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (https://www.semtech.com/uploads/documents/sx1272.pdf#page=125), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf.

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