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BackX 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments BGA-289, 0.4mm pad, based on the v1 board between R25 and R1. This needs to be fixed elsewhere 4675f71e05fc19d3608ee6e5061bbe79ae432fb7 c4e1c30b9b Add jlc constraints DRC; replace order number text Compare 19 commits » 14162964f9 Add circuit blocks to kick drum schematic main arrasta/samba_reggae.txt 82 lines REP: repique CAX: caixa MSD: mid surdo BSD: back surdo (L for low, H for high)