Labels Milestones
BackSize 85x9mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-2-5.0-H, 2 pins, diameter 5.0mm z-position of LED center 3.0mm 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm, 2 pins LED, diameter 8.0mm, 3 pins THT ceramic resonator filter DSS6 SMD Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD SMT ceramic resonator filter Ceramic Resomator/Filter Murata SFSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM3C http://www.abracon.com/Resonators/abm3c.pdf, 5.0x3.2mm^2 package Fox TXCO temperature compensated oscillator SMD Crystal Seiko Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 9.6x4.1mm^2 package SMD Crystal TXC 9HT11 http://txccrystal.com/images/pdf/9ht11.pdf, 2.0x1.2mm^2 package SMD Crystal MicroCrystal CC8V-T1A/CM8V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 7.9x3.8mm^2 package SMD Crystal Oscillator Seiko Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 8.0x3.2mm^2 package SMD SMT SPST EVQPUJ EVQPUA SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket THT DIP DIL ZIF 15.24mm 600mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Piano, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm.
- Connector, 502386-1270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate.
- Https://www.minicircuits.com/pdfs/TC1-1-13M+.pdf WE-AGDT Auxiliary Gate.
- Edge card connector socket for 1.57mm PCBs, vertical.
- INCLUDING ANY GENERAL, SPECIAL, INCIDENTAL.
- 8". 0 0 Y N 1 F N.