Labels Milestones
Back289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 2x05 2.54mm double row surface-mounted straight pin header, 2x04, 2.54mm pitch, single row Surface mounted socket strip SMD 1x27 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x30 1.00mm single row Through hole IDC header, 2x08, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x18, 2.54mm pitch, double rows Through hole straight pin header, 2x37, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x08 5.08mm single row Through hole straight socket strip, 2x48, 1.27mm pitch, 4.4mm socket length, single row Surface mounted socket strip SMD 1x13 1.00mm single row Through hole socket strip THT.