3
1
Back

[eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://www.ti.com/lit/ds/symlink/msp430f5232.pdf#page=111), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-138 , 8 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-8DP-2DSA, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST EH series connector, 501331-1307 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py ST HLGA, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 76 Pin (https://ftdichip.com/wp-content/uploads/2020/07/DS_FT600Q-FT601Q-IC-Datasheet.pdf#page=27), generated with kicad-footprint-generator JST GH series.

New Pull Request