3
1
Back

Pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x21 1.27mm single row Through hole straight socket strip, 1x40, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 1x10 2.00mm single row Through hole Samtec HPM.

New Pull Request