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1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x37 1.00mm single row Through hole angled pin header, 2x09, 1.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x34, 2.00mm pitch, double rows Surface mounted pin header THT 1x40 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x30 1.00mm double row Through hole straight pin header, 1x01, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x21 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x18, 1.27mm pitch, double rows Through hole angled socket strip, 2x12, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header, 2x10, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header THT 2x12 1.27mm double row Through hole socket strip SMD 1x02 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x28 2.00mm single row Through hole angled pin header, 2x39, 1.00mm pitch, single row style2 pin1 right Through hole pin header THT 1x29 2.00mm single row Surface mounted pin header SMD 2x01 2.00mm double row surface-mounted straight socket strip, 2x14, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x19, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight pin header, 1x08, 1.27mm pitch, double rows Through hole angled.

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