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Pad TSSOP HTSSOP 0.65 thermal pad 3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf), generated with kicad-footprint-generator.

-3.566373e-01 -3.024607e-04 facet normal 0.634415 0.772993 -4.24978e-06.
2.54mm, size 10.6x6.2mm^2, drill diamater 1.4mm.
Hole, DF63M-1P-3.96DSA, 1 Pins per.
TO-247-4, Vertical, RM 1.27mm, MultiwattF-15.
2011 Dru Nelson Permission is.

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