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(T2044-2)), generated with kicad-footprint-generator connector Hirose DF13 through hole, DF11-26DP-2DSA, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic Micro Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (3mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST Copal_CHS-10A, Slide, row.

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