Labels Milestones
BackMils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 10-lead though-hole mounted DIP package, row.
- CA9-H5, http://www.acptechnologies.com/wp-content/uploads/2017/05/02-ACP-CA9-CE9.pdf Potentiometer vertical Bourns PTV09A-1.
- UFBGA-15, 4x4, 3x3mm package.
- Rotary switch, 5+ positions - 10 .