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Bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81.

• 55932-1310, with PCB locator, 6.
• -4.994258e+000 -2.966879e+000 2.470887e+001 facet normal -0.284757.
• SMD 2x32 1.00mm double row surface-mounted straight.
• Shaft_radius = 3.25; shaft_height = 13.
• -4.873291e+000 -2.885563e+000 1.747200e+001 facet normal.

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