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BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole IDC header, 2x10, 1.00mm pitch, double rows Through hole angled socket strip, 2x45, 1.27mm pitch, single row Through hole pin header THT 1x24 1.27mm single row Surface mounted socket strip THT 1x11 2.00mm single row Surface mounted socket strip THT 2x09 2.54mm double row Through hole angled socket strip THT 2x05 2.54mm double row Through hole socket strip THT 2x31 1.27mm double row Through hole socket strip SMD 2x09 1.27mm double row Through hole pin header SMD 2x35 2.00mm double row Through hole straight pin header, 2x05, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x39, 2.00mm pitch, double rows Surface mounted pin header THT 2x08 1.00mm double row Through hole pin header, 2x26, 2.54mm pitch, 8.51mm socket.

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