Labels Milestones
Back372, 8.5x8mm, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_372_datasheet.pdf.pdf Fuse, TE5, Littelfuse/Wickmann, No. 460, No560, Fuse TE5 Littelfuse/Wickmann No. 460 No560 Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC, Heatsink, Sheet type, 50x7mm, 2 fixations (solder), Choke, SMD, 12x12mm 6mm height Choke, SMD, 4.0x4.0mm 2.1mm height, https://www.tracopower.com/products/tck141.pdf Low Profile, High Current Inductors (https://www.vishay.com/docs/34295/sc15ah01.pdf SMD Vishay Inductor Low Profile DFS "Flat", see http://www.vishay.com/docs/88874/dfl15005.pdf SMD diode bridge 9.8mm WOG pitch 5.08mm 0.5W = 1/2W length 8.38mm width 2.54mm Resistor, Box series, Radial, pin pitch=22.50mm, , length*width=24*12.2mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.08mm size 15.2x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00019 pitch 5mm Varistor, diameter 9mm, width 3.9mm, pitch 5mm Varistor, diameter 15.5mm, width 6.4mm, pitch 7.5mm size 24.8x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-436 45Degree pitch 5mm size 35x7.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00083 vertical pitch 2.5mm size 10.5x5mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PT-1,5-13-3.5-H, 13 pins, pitch 10mm, size 122x14mm^2, drill diamater 1.3mm, pad diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, B14B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST GH side entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-184 , 24 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-LC, 40 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer.
- 1x Fixation 3mm, Fischer SK486-35 Heatsink, 38x38mm, Spring.
- MLF, 20 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated.
- Tweaks after pro review main arrasta/Samba_Reggae_1.html.