Labels Milestones
BackPad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 2x22 2.54mm double row Through hole angled socket strip, 1x15, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x37 2.54mm double row Through hole angled socket strip SMD 1x28 2.00mm single row Through hole angled pin header, 1x13, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x34 2.54mm single row Surface mounted socket strip SMD 2x35 2.54mm double row surface-mounted straight socket strip, 2x49, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x35, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip, 2x14, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x13 2.54mm single row Through hole IDC box header 2x30 2.54mm double row Through hole IDC header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 1x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x13, 2.00mm pitch, 4.2mm pin length, double.
- , length*width=29*11mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series.
- Vertical w/o Stability Pins; 250V.