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LFCSP, 8 Pin (https://www.qorvo.com/products/d/da007268), generated with kicad-footprint-generator Molex PicoBlade series connector, DF52-9S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 20 leads; body width 16.90 mm Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 8 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 56 leads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-03A example for new part number: A-41791-0018 example for new part number: 26-60-5150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-12A example for new part number: A-41792-0011 example for new mpn: 39-28-906x, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Through hole angled pin header, 2x05, 2.54mm pitch, single row Surface mounted socket strip SMD 1x37 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x36, 1.00mm pitch, double rows Through hole horizontal IDC header THT 1x37 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x25 1.00mm single row Through hole straight pin header, 1x30, 2.00mm pitch, double rows Through hole IDC header, 2x06, 1.27mm pitch, single row Through hole angled pin header SMD 1x37 1.27mm single row style2 pin1 right Through hole straight pin header, 2x30, 1.27mm pitch, 4.0mm pin.

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