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POWER, Type JTE06 Series, Dual Output DCDC-Converter XP_POWER IHxxxxDH, DIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator JST XA series connector, SM05B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105314-xx06, 3 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, S32B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_11.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105310-xx06, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XA series connector, DF52-7S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-8DP-2DSA, 4.

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