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11P Inductor, Radial series, Radial, pin pitch=5.00mm, , diameter=12.5mm, Fastron, 09HCP, http://cdn-reichelt.de/documents/datenblatt/B400/DS_09HCP.pdf Inductor Radial series Radial pin pitch 34.29mm diameter 50.8mm Vishay IHB-6 Inductor, Radial series, Radial, pin pitch=5.00mm, , diameter*width=6*4.4mm^2, Capacitor C Radial series Radial pin pitch 5.60mm length 13mm width 8mm Capacitor C, Rect series, Radial, pin pitch=13.50mm, , length*width=31.8*15.9mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf L_Toroid Vertical series Radial pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS485 IS486 package for diode bridges, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL ZIF 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils.

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