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HLE-138-02-xxx-DV, 38 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, S06B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (www.ti.com/lit/ds/symlink/tps7a7200.pdf#page=36), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CD), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S8B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter.

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