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1.5mm THT rectangular pad as test point, loop diameter2.6mm, hole diameter 1.3mm, wire diameter 1.0mm (press fit), length 10.0mm solder Pin_ diameter 1.0mm, hole diameter 1.0mm wire loop as test point, pitch 2.0mm, hole diameter 1.5mm THT rectangular pad as test Point, square 2.0mm side length SMD rectangular pad as test Point, square 3.0mm side length SMD rectangular pad as test Point, square 2.5mm side length, hole diameter 1.85mm wire loop as test Point, diameter 1.5mm SMD pad as test Point, square 1.0mm side length, hole diameter 0.7mm, wire diameter 1.0mm (press fit), length 10.0mm solder Pin_ with flat with hole, hole diameter 1.3mm, hole diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-135 , 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xxx-DV-BE-A, 26 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic PSOP, Exposed Die.

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