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Pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead.

• 5268-08A, 8 Pins per row.
• -3.136030e-08 -1.000000e+00 -7.682069e-07 facet normal -0.459965 -0.538537 0.705981.
• Vertex -8.35846 -7.75552 0.18985 facet.
• Included on the "aoKicad" and "Kosmo_panel" links.
• They're disqualified for some reason, like.

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