Labels Milestones
BackSSOP24: plastic shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 10 leads; body width 4.4 mm; thermal pad with vias.
- (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator Molex Micro-Fit.
- \#* New KiCad version; non Al panel Gerbers.
- GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-236, including.