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Plastic Quad Flat, No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 40-lead though-hole mounted.

9.482107e-001 vertex 7.261490e-001 -4.509390e+000 2.495526e+001.
-0.638329 facet normal -0.95694 0.288329 0.0336382 facet.
To 9mm and align it.
Normal 0.980977 0.194125 -4.03034e-07 vertex 1.2887 -3.16866 6.59.

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