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TO-220F-4 Vertical RM 0.9mm staggered type-2 TO-220F-9, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 2.29mm IPAK TO-251-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 10.95mm SOT-93 TO-218-3, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-9, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 5.08mm TO-126-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-4 Horizontal RM 2.54mm TO-220-4, Vertical, RM 2.54mm, staggered type-1 TO-220-5, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220F-9, Vertical, RM 2.286mm SIPAK, Vertical, RM 0.9mm, staggered type-1 TO-220-4 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-2, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220-7 Horizontal RM 5.08mm TO-126-2, Vertical, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Vertical RM 1.27mm staggered type-2 TO-220-4, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

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