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BackSot158-1_po.pdf VSO56: plastic very small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 14 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator connector Molex Pico-EZmate_Slim series connector, 502494-1570 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator LED SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with.
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