Labels Milestones
Back1 RF1157 RF1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x14, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header, 2x35, 1.27mm pitch, 4.0mm pin length, double rows Through hole horizontal IDC header THT 1x35 1.00mm single row Through hole angled socket strip THT 2x12 2.00mm double row Through hole angled pin header THT.
- Connection with feed through strain relief.
- -2.682343e-001 1.747200e+001 facet normal -1.379493e-13.
- (c) 2004,2005, Richard Boulton Copyright (c) 2021.