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20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 2x25, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip SMD 2x10 1.27mm double row SMD IDC box header, 2x13, 1.00mm pitch, double rows Through hole angled pin header THT 1x40 2.00mm single row Through hole socket strip THT 1x30 2.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x10, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x21, 2.00mm pitch, 6.35mm socket length, single row Through hole angled.

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